3C Aluminum for
electronics
3C Aluminum for electronics
3C aluminum for electronic products, specially designed for electronic product use. Compared with traditional aluminum, it has the characteristics of more environmental protection, more beautiful and higher strength.
KEY BENEFITS
High Strength
Anodizing without
shading
Low cost
Low carbon and
environmental protection
Exterior pieces
| Alloy: | 6063 R |
|---|---|
| Temper: | O T4 T6 |
| Density: | 2.69 g/cm3 |
| Poisson's ratio: | 0.33 |
| Elastic modulus: | 68.3Gpa |
| Electrical conductivity: | 53%IACS |
| Thermal conductivity: | 202W/（m.K） |
|
Si |
Fe |
Cu |
Mn |
Mg |
Cr |
Zn |
Ti |
Other element |
||
|---|---|---|---|---|---|---|---|---|---|---|
|
Unit |
Total |
|||||||||
|
upper limit |
0.6 |
0.35 |
0.1 |
0.1 |
0.9 |
0.1 |
0.1 |
0.1 |
0.05 |
0.16 |
|
lower limit |
0.2 |
- |
- |
- |
0.45 |
|
- |
- |
- |
- |
■ 180# zirconium sandblasting anode has no material pattern, which can meet the needs of high anode appearance.
■ Good dimensional stability, no deformation after CNC machining.
■ It can be continuously stamped and formed, suitable for mobile phones, laptop and other exterior products.
| Alloy: | 7S50 |
|---|---|
| Temper: | O T6 |
| Density: | 2.8 g/cm3 |
| Poisson's ratio: | 0.33 |
| Elastic modulus: | 71Gpa |
| Electrical conductivity: | 33%IACS |
| Thermal conductivity: | 130W/（m.K） |
|
Si |
Fe |
Cu |
Mn |
Mg |
Cr |
Zn |
Ti |
Other element |
||
|---|---|---|---|---|---|---|---|---|---|---|
|
Unit |
Total |
|||||||||
|
upper limit |
0.2 |
0.4 |
0.1 |
0.1 |
1.8 |
0.05 |
6.5 |
0.1 |
0.05 |
0.16 |
|
lower limit |
- |
- |
- |
- |
1.0 |
|
5.0 |
- |
- |
- |
■ 150# zirconium sandblasting anode has no material pattern, which can meet the needs of high anode appearance.
■ High strength, suitable for mobile phone frames and other products.
■ The corrosion resistance of the machining process is better than that of similar 7 series alloys.
Application
Mobile Case
Laptop computer case
Pad case
Structural parts
KEY BENEFITS
High strength,
high thermal conductivity
High elongation
Dimensionally stable
| Alloy: | 5B59 |
|---|---|
| Temper: | O H32 H34 H36 H38 |
| Density: | 2.67 g/cm3 |
| Poisson's ratio: | 0.33 |
| Elastic modulus: | 71.2Gpa |
| Electrical conductivity: | 53%IACS |
| Thermal conductivity: | 125W/（m.K） |
|
Si |
Fe |
Cu |
Mn |
Mg |
Cr |
Zn |
Ti |
Other element |
||
|---|---|---|---|---|---|---|---|---|---|---|
|
Unit |
Total |
|||||||||
|
upper limit |
0.2 |
0.35 |
0.25 |
1.0 |
6.0 |
0.05 |
0.05 |
0.05 |
0.05 |
0.15 |
|
lower limit |
- |
- |
- |
0.2 |
5.0 |
- |
- |
- |
- |
- |
■ High strength, good molding, low residual stress, good flatness, adapt to the needs of various 3C products
| Alloy: | 5182 |
|---|---|
| Temper: | O H32 H34 |
| Density: | 2.65 g/cm3 |
| Poisson's ratio: | 0.33 |
| Elastic modulus: | 70.9Gpa |
| Electrical conductivity: | 35%IACS |
| Thermal conductivity: | 123W/（m.K） |
|
Si |
Fe |
Cu |
Mn |
Mg |
Cr |
Zn |
Ti |
Other element |
||
|---|---|---|---|---|---|---|---|---|---|---|
|
Unit |
Total |
|||||||||
|
upper limit |
0.2 |
0.35 |
0.15 |
0.5 |
5.0 |
0.1 |
0.25 |
0.1 |
0.05 |
0.15 |
|
lower limit |
- |
- |
- |
0.2 |
4.0 |
- |
- |
- |
- |
- |
■ It has medium to high strength and can be continuously stamped
■ Low residual internal stress, suitable for the design and use of small size products
■ It can meet 90 degree bending, but 180 degree bending is prone to fracture.
Application
Phone midplate
Keyboard deck
